Building Chips in America Act of 2023

Cost and committee reports

Official records Congress.gov attaches to H.R. 4549.

• Constitutional authority statementThe sponsor’s statement of where the Constitution gives Congress the power to pass this bill. Statement by Mrs. KIGGANS of Virginia, as printed in the Congressional Record (Vol. 169, No. 118, July 11, 2023, Page H3207):
  Article 1, Sec. 8 The single subject of this legislation is: To allow domestic semiconductor manufacturers flexibility when conducting necessary environmental reviews if their facility is already under construction.
  Source: Congress.gov, Congressional Record July 11, 2023 ↗

  Evidence

  Field in the Congress.gov record

  constitutionalAuthorityStatementText

  Statement length

  215 characters

  Congress.gov bill record

  H.R. 4549, 118th Congress

  Congress.gov API record

  https://api.congress.gov/v3/bill/118/hr/4549

  Record last updated by Congress.gov

  December 5, 2025

  PORKER copy retrieved

  September 14, 2026

  Stored copy, SHA-256 of the file

  e8e9a96efc35de9966cfb0d57572106f18f7ea5616131e6c59629752f9008a0b

  PORKER shows the statement exactly as printed, with the page markup removed. It is the sponsor’s claim; it is not a legal finding.

Congress.gov’s record for this bill does not list a CBO cost estimate or a committee report (as of December 5, 2025). Not every bill gets one.

From the Congress.gov bill record for H.R. 4549, last updated December 5, 2025. PORKER’s copy was retrieved September 14, 2026 and is refreshed nightly. Open “Evidence” on any line for the record, field and file fingerprint.